Flexible encapsulation thin film 

In the conventional flexible encapsulation thin film, a thin compact inorganic Oxides and nitrides layer was usually used as the barrier layer. The soft polymer layers, sandwiched between two subsequent hard inorganic barrier layers, minimized the propagation of defects in the inorganic layer, which improved the barrier performance grammatically. However, the inorganic layers were too stiff to be used as stretchable encapusulation materials in the wearable electronic devices. Therefore we designed two novel encapsulation structures to solve this problem:

1.Based on the conventional multilayered structures, the functional layers were deposited on with a waved surface fabricated by micro-fabrication process, such as photolithographic process. This structure could convert the stretching stress into bending stress in the film which made it suitable for the encapsulation of the stretchable devices.  

2.The Elastomer mixed with amount of two-dimensional nanofillers such as clay or graphene was used as the encapsulation materials. In this structure, the layered two-dimensional materials could lengthen the pathway for the gas permeants due to the increased tortuosity, which could still remain good barrier property even under stress.