Center of Advanced Electronic Material Research of Shenzhen Institutes of Advanced Technology (SIAT), Chinese Academy of Sciences (CAS), was founded in 2006. The center is dedicated to developing advanced materials, both for fundamental researches and industrial applications. Over the past 10 years, CAMR has actively participated in or undertaken more than 100 national scientific and industrial programs, published nearly 450 SCI journal papers and 380 patents. The center has become member of the “National Engineering Laboratory for Advanced Electronic Packaging Materials”. In view of long-term development and relying on the good electronic information industry environment of Guangdong and Shenzhen, CAMR established the Advanced Electronic Packaging Materials Innovation Team of Guangdong Province in 2012. In terms of industrialization, we work closely with middle and downstream customers and domestic equipment companies to achieve the mass production of domestic high-end wafer level packaging materials, leading the world in comprehensive performance and becoming one of the breakthroughs of domestic high-end electronic packaging materials.