Center of Advanced Material Research (CAMR) of Shenzhen Institutes of Advanced Technology (SIAT), Chinese Academy of Sciences (CAS), was founded in 2006. The center is dedicated to developing advanced materials, both for fundamental researches and industrial applications. Over the past 10 years, CAMR has actively participated in or undertaken more than 100 national scientific and industrial programs, published nearly 250 SCI journal papers and 200 patents. The center has become member of the “National Engineering Laboratory for Advanced Electronic Packaging Materials”. In view of long-term development and relying on the good electronic information industry environment of Guangdong and Shenzhen, CAMR established the Advanced Electronic Packaging Materials Innovation Team of Guangdong Province in 2012, led by Prof. Ching-Ping Wong, who is member of the American Academy of Engineering and Foreign Academician of Chinese Academy of Engineering, focusing on the development of key materials for the high density 3D wafer level and system-in package technologies.
Advanced Electroninc Packaging Materials and Complete Technology
Areas of Interest:electronic packaging
Areas of Interest:Nanomaterials
Areas of Interest:Nanocomposites
Areas of Interest:wearable sensors
Areas of Interest:nanomaterials