Liu zhiquan, researcher professor, innovation project leader, doctoral supervisor.

Director of electronic manufacturing and packaging technology branch of China electronics society, member of national integrated circuit sealing and testing industry chain technology innovation strategic alliance, member of national integrated circuit standardization general working group, director of liaoning semiconductor equipment industry technology innovation strategic alliance.

He has long been engaged in microstructure characterization and in situ preparation of materials related to properties, focusing on the microstructure properties and service reliability of microelectronic materials and packaging structures. Up to now, he has published 139 journal papers, including Nature, Science, ACS Catalyst, Phys. Rev. Lett., Acta Mater. In addition, I published 33 papers included in EI for international conferences, and made more than 10 invitation reports at international conferences. It has 18 Chinese invention patents, 1 Japanese invention patent and 1 American invention patent, and 13 Chinese invention patents have been applied for.