Shenzhen electronic encapsulation materials engineering laboratory, aimed at the system level to encapsulate functional embedded function of substrate materials and realize 3 d stacked chip of silicon hole insulating material as the breakthrough point, solve common problems in electronic packaging materials, development and used for electronic packaging material processing equipment, and gradually expand to research and development direction to high thermal conductive substrate material application of high density packaging involved in each key materials, to integrate the research and development of the material in the system level. Install corresponding technology modules to continuously promote the improvement of electronic packaging industry technology in shenzhen.